As one of the fastest growing companies in the industry, we offer generous compansation package as well as the unlimited growth opportunities.

Our company invites experienced power management chips field application manager.
Eligible needs to have power management chips application, power supply or electronic system design (mobile phones, digital cameras, liquid crystal TV, etc) and related field work experience.
We will provide excellent stock incentive and incentive mechanism.
 

Job Opportunities

Digital IC Designer      IC Packaging Development Engineer      Field Applications Manager      Senior Sales      Sales Manager      Senior FAE      FAE Manager      AE Manager      Senior AE      IC Test Engineer      Accountant       

Digital IC Designer

Responsibilities:
1. Working on digital module design/verification/backend;
2. Responsible for RTL design & simulation, FPGA verification, backend design, mixed chip DRC/LVS etc.;
3. Cooperating tightly with analog group, interfacing to supporting groups such as design, layout, test, and application engineering.

Requirements:
1. Tapeout and working experiences from RTL to GDS.
2. Familiar with ASIC design flow - front/back-end;
3. Familiar with EDA tools such as VCS/Modelsim, Design Compiler, Prime Time, ICC/Encounter etc.;
4. Experience on Verilog/VHDL design such as I2C, SMBUS, SPI, 51core etc.;
5. Experience on FPGA verification;
6. Good oral and written English communication skills;
7. Creative, self-motivated, responsible, good team work spirit.

Location:

Hangzhou, Nanjing

IC Packaging Development Engineer

Responsibilities:
1.Work with company’s R&D team to design, develop and optimize the packaging solutions for new IC product designs during the product definition. Evaluate the new package and assembly process robustness in pre-qualification stage to ensure the first pass success.
2.Work with assembly subcontractors to develop,qualify and sustain the package in high volume production, and solve the manufacturing process issues.

Requirements:

1.BS/MS with minimum 5 years of package technology development experience within a high volume semiconductor manufacturing environment;
2.Previous experience on wafer bumping technology, flip-chip or MCM is a strong plus.
3.Strong fundamental in the fields of electronic packaging related mechanics and material science.
4.Hands-on knowledge of package reliability, failure analysis techniques and assembly process issues.
5.Communicate well, have strong analytical skills, be attentive to detail, and be able to work both independently as well as in a team environment.

Location: Hangzhou

Field Applications Manager

Responsibilities:
1.Promotion on power management chips, provide timely technical support
2.Track project needs
3.Assist in preparing for product promotion materials, the sales team and distributors field application engineer training
4.feedback new product information to R&D


Requirements:

.Above 8 years electronic industry work experience, or bachelor degree and with 5 years work experience, or master degree with at least 2 years work experience
2.Familiar with the power management chips products: principles and applications
3.Fluent communication skills: writen&oral

Location:

Hangzhou, Shenzhen, Xian, Wuhan, Guangzhou, Chengdu

Senior Sales

Responsibilities:

1.Promotion on power management chips, opening new market, develop new customers, increase product sales scope
2.Make products quotation&inventory management
3.Timely tracking sales project, promote the smooth development for the project
4.Manage distribution channels
5.Provide sales budget plan

Requirement:

1.5 years or above sales working experience in electronic industry
2.Familiar with in the northern region of the consumer electronics market
3.Good communication ability, market development ability
4.good team cooperation spirit
5.Good at learning, can work under high pressure, challenging spirit

Location: Beijing, Fuzhou, Hangzhou, Beijing, Wuhan, Guangzhou, Chengdu

 

 

Sales Manager

Responsibilities:
1.Promotion on power management chips
2.Make products quotation&inventory management
3.Timely tracking sales project
4.Management distribution channels
5.Provide sales budget plan

Requirement:
1.Above 5 years electronic industry Sales work experience
2.Familiar with south China electronics market
3.Fluent communication skills


Location: Hangzhou, Shenzhen, Xian

Senior FAE

Responsibilities:
1.Promotion on power management chips, provide timely technical support
2.Track project needs
3.Assist in preparing for product promotion materials, the sales team and distributors field application engineer training
4.feedback new product information to R&D

Requirement:
1.bachelor degree and with 5 years work experience, or master degree with at least 2 years work experience
2.Familiar with the power management chips products: principles and applications
3.Fluent communication skills: writen&oral

Location: Hangzhou, Shanghai, Guangzhou, Ningbo

FAE Manager

Responsibilities:
1.Promotion on power management chips, provide timely technical support
2.Track project needs
3.Assist in preparing for product promotion materials, the sales team and distributors field application engineer training
4.feedback new product information to R&D

Requirement:
1.Above 8 years electronic industry work experience, or bachelor degree and with 5 years work experience, or master degree with at least 2 years work experience
2.Familiar with the power management chips products: principles and applications
3.Fluent communication skills: writen&oral


Location: Hangzhou, Shenzhen, Xian

AE Manager

Responsibilities:
1.Leadership application team
2.Screening of new products (power/analog integrated circuit products) advice with design team, system engineering team & on-site, make the product specification according to customer demand.
3.Responsible for new product development process test, DEMO plate production specifications, the writing and other technical support, and responsible for new product promotion of audit, technical specifications of the article published
4.Make effective system to give technical support for key customers and FAE. This position requires at least visit the key customer twice a year .

Requirement:

1.7 years experience in the electronic engineering  with bachelor degree/4 years experience in the electronic engineering master/2 years experience in the electronic engineering doctor
2.Excellent communication skills and Leadership
3.Excellent written and oral presentation skill
4.Outstanding management skills
5.Excellent English written, listening and oral skills
6.Must have work experience in semiconductor manufacturer, distributor or power management IC design company and market development of relevant
7. Has the ability to hiring great people
8.A management experience
9.A design application experience of renewable energy, AC/DC power supply, isolation type DC/DC power supply, D kind of power amplifier, inverter, electronic ballast, motor drive, electric bicycle/car is preferred

Location: Nanjing, Hangzhou, Xi-an

Senior AE

Responsibilities:
1.Leadership application team
2.Screening of new products (power/analog integrated circuit products) advice with design team, system engineering team & on-site, make the product specification according to customer demand.
3.Responsible for new product development process test, DEMO plate production specifications, the writing and other technical support, and responsible for new product promotion of audit, technical specifications of the article published
4.Make effective system to give technical support for key customers and FAE. This position requires at least visit the key customer twice a year .

Requirement:

1.5 years experience in the electronic engineering  with bachelor degree/2years experience in the electronic engineering master
2.Excellent English written, listening and oral skills
3.Excellent written and oral communication skills
4.A management experience
5.A design application experience of renewable energy, AC/DC power supply, isolation type DC/DC power supply, D kind of power amplifier, inverter, electronic ballast, motor drive,   electric bicycle/car is preferred

Location: Hangzhou, Nanjing, Xi-an

IC Test Engineer

Responsibilities:
1.corporate with the design engineer, complete test program and IC product failure analysis work
2.cooperate with application engineer, complete test procedure optimization 
3. cooperate with test fabs complete product's test processing work 
4. familiar with IC products QA architecture, complete product QA work

Requirement:
1.electronics, communication, instrument and apparatus, bachelor degree or above, familiar with the basic knowledge of electronic circuit;
2.can read English material of the professional product ;
3.2 years or above measurement or into the experience 
4. can test products independently
5.have certain analog circuits, c + + program basis
6.familiar with ASL1000, ETS and at least a testing machine
7.familiar with protel, PADS and at least a PCB LAYOUT software
8.work spirit, good teamwork spirit and strong communication skill

Location: Hangzhou, Nanjing, XiAn

Accountant

Responsibilities:
1.Responsible for the company's daily accounting business
2.Responsible for the company's subsidiary ledger and general ledger, fixed assets management
3.Firm accounting statements, writing that financial statements
4.Coordination company of foreign finance, taxation, industry and commerce and bank departments
5.Responsible for the company's fill, declare tax information

Requirement:

1.Financial related bachelor degree, with intermediate accountant the title is preferred
2.3 years accountant working experience (foreign enterprise financial experience)
3.Familiar with accounting software, skilled in the operation of a computer and office equipment, the office software skilled, clap hold
4.Familiar with financial cost analysis, financial budget, cost accounting, tax, financial management process
5.Good English reading and writing ability
6.Serious, meticulous, well organized, honest, decent, have a high sense of responsibility, good job industry ethics, keep company financial confidential, no bad career record

Location: Nanjing, Hangzhou

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